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Thermal Two-Part Hybrids

HLT2000

Honeywell HLT series products are two-component cured-in-place dispensable gap fillers could be easily dispensed w/good thixotropic characteristics and low viscosity, provides the high compressibility and excellent long term reliability. (2.0 W/m·K)

Two-Part, Dispensable, Very Low Compression Force HLT series products are two-component, dispensable thermally conductive gels, which offer long-term reliability and superior softness. The enhanced bonding force between the polymer base and the filler minimizes oil separation issues in storage. Prior to curing, the material maintains good thixotropic characteristics and low viscosity to be easily dispensed.Typical Applications• Consumer electronics• Telecommunications equipment• Automotive electronics• Memory & power modulesFeatures• Low contact resistance• Easily to dispense and rework• High compressibility for low stress applications• Long-term reliability• Reduced oil separation• No pump-out and cracking

Physical Properties

  • Viscosity
    • 200000-350000 cps, Test Method ASTM D2196 (Brookfield Viscometer, #7 spindle, 10 rpm)
  • Color
    • Part A: Yellow, Part B: White
  • Cure Schedule
    • 30 min at 100 °C
    • 10 hours at 25 °C
  • Thermal Conductivity
    • 2.0 W/m-K, Test Method ASTM D5470
  • Thermal Impedance
    • 0.66 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method D5470
  • Specific Gravity
    • 2.8, Test Method ASTM D792

Physical Properties

  • Viscosity
    • 200000-350000 cps, Test Method ASTM D2196 (Brookfield Viscometer, #7 spindle, 10 rpm)
  • Color
    • Part A: Yellow, Part B: White
  • Cure Schedule
    • 30 min at 100 °C
    • 10 hours at 25 °C
  • Thermal Conductivity
    • 2.0 W/m-K, Test Method ASTM D5470
  • Thermal Impedance
    • 0.66 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method D5470
  • Specific Gravity
    • 2.8, Test Method ASTM D792
  • Viscosity : 200000-350000 cps, Test Method ASTM D2196 (Brookfield Viscometer, #7 spindle, 10 rpm)
  • Color : Part A: Yellow, Part B: White
  • Cure Schedule : 30 min at 100 °C|10 hours at 25 °C
  • Thermal Conductivity : 2.0 W/m-K, Test Method ASTM D5470
  • Thermal Impedance : 0.66 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method D5470
  • Specific Gravity : 2.8, Test Method ASTM D792