Honeywell RadLo™ materials include solder material of various low alpha grades for devices challenged by soft errors. We continually re-invest in the development of low alpha materials.

RadLo materials are used in advanced solder bumping applications such as solder microspheres and copper pillar solder caps. These features are common in advanced flip chip and 3-D wafer-level chip packages.

These materials are located closer to sensitive device features, which means that their alpha emissions are often the root cause of soft errors. RadLo’s low level of alpha emissions results in a significant reduction in soft error rates.

RadLo materials are available in various form factors, including pellets and ingots for solder feedstock, plating anodes, and plating solution materials. Our solder feedstock is used to create solder microspheres and solder paste. RadLo materials are manufactured to meet purity levels of at least 4N (99.99%) and are processed in our facility in Spokane, Washington.

CUSTOM DEVELOPMENT
Honeywell’s development team can partner with customers, including manufacturers of electroplating systems, to create custom alloys for all form factors.