Honeywell Electronic Materials is an industry leader in the production of a wide range of die attach products including eutectic and soft solder in a variety of forms. We offer a full range of lead and lead-free alloys, with an open tool list and custom capability.
Low alpha materials
- Sn Oxide for bump plating and solder
- Pb solder wire
- Pb-free solder wire
- High purity evaporation charges
Bonding wire – diameters down to 0.7 mils
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High Purity Evaporation Materials
Metals for dieback metallization and underbump metallurgy (UBM ) for flip chip applications.
Honeywell Plating Anodes, backed by our robust supply chain and metrology capabilities, provide consistency and reliability in performance.