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Thermal One-Part Hybrids

HT4500

Thermal conductivity liquid gap fillers have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability — they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces.

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One-Part Dispensable Very Low Compression ForceThermal conductivity liquid gap fillers not only have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability — they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces. Hybrid is a substance between liquid and solid, combining the advantages of thermal grease and thermal gap pad. Typical Applications• Consumer electronics • Telecommunications equipment • Automotive electronics • Power supplies & semiconductors • Memory & power modules • Power electronics Features • High thermal performance and low contact resistance • Easily dispensable and reworkable • High compressibility for low stress applications Long-term reliability • No pump-out or cracking risk • Reduced oil separation • Requires no mixing, additional curing or low temperature storage

Physical Properties

  • Cure Schedule
    • Pre-cured
  • Color
    • Green
  • Specific Gravity
    • 3.3, Test Method ASTM D792
  • Shelf Life
    • 6 months

Thermal Properties

  • Thermal Conductivity
    • 4.5 W/m-K, Test Method, ASTM D5470

Electrical Properties

  • Volume Resistivity
    • >1.0X1013 ohm-cm, Test Method ASTM D257
  • Dielectric Strength
    • 5 KV/mm, Test Method D149

Temperature

  • Storage Temperature
    • RT

General Information

  • Key Features
    • Printable
    • High thermal performance and low contact resistance
    • High compressibility for low stress applications
    • Long-term reliability
    • No pump-out or cracking risk
    • Reduced oil separation
    • Easily dispensable and reworkable
  • Application
    • Automation Gap Filler
  • Typical Uses
    • Consumer electronics
    • Telecommunications equipment
    • Power supplies
    • Memory & power modules
    • Power electronics
    • Automotive electronics

Physical Properties

  • Cure Schedule
    • Pre-cured
  • Color
    • Green
  • Specific Gravity
    • 3.3, Test Method ASTM D792
  • Shelf Life
    • 6 months

Thermal Properties

  • Thermal Conductivity
    • 4.5 W/m-K, Test Method, ASTM D5470

Electrical Properties

  • Volume Resistivity
    • >1.0X1013 ohm-cm, Test Method ASTM D257
  • Dielectric Strength
    • 5 KV/mm, Test Method D149

Temperature

  • Storage Temperature
    • RT

General Information

  • Key Features
    • Printable
    • High thermal performance and low contact resistance
    • High compressibility for low stress applications
    • Long-term reliability
    • No pump-out or cracking risk
    • Reduced oil separation
    • Easily dispensable and reworkable
  • Application
    • Automation Gap Filler
  • Typical Uses
    • Consumer electronics
    • Telecommunications equipment
    • Power supplies
    • Memory & power modules
    • Power electronics
    • Automotive electronics
  • Cure Schedule : Pre-cured
  • Thermal Conductivity : 4.5 W/m-K, Test Method, ASTM D5470
  • Color : Green
  • Specific Gravity : 3.3, Test Method ASTM D792
  • Shelf Life : 6 months
  • Volume Resistivity : >1.0X1013 ohm-cm, Test Method ASTM D257
  • Dielectric Strength : 5 KV/mm, Test Method D149
  • Storage Temperature : RT
  • Key Features : Printable|High thermal performance and low contact resistance|High compressibility for low stress applications|Long-term reliability|No pump-out or cracking risk|Reduced oil separation|Easily dispensable and reworkable
  • Application : Automation Gap Filler
  • Typical Uses : Consumer electronics|Telecommunications equipment|Power supplies|Memory & power modules|Power electronics|Automotive electronics
Others
Name
Description
File Size
Date
Size
HT4500 - Thermally Conductive Gap Filler
application/pdf 42.4 KB
11/8/2022
42.4 KB
Brochure
Name
Description
File Size
Date
Size
879055 ADM FLR TIMs LTR
application/pdf 73.66 KB
9/7/2022
73.66 KB
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
9/7/2022
819.47 KB
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
9/14/2022
819.47 KB
879055 ADM FLR TIMs LTR
application/pdf 73.66 KB
9/14/2022
73.66 KB
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
11/8/2022
819.47 KB
879055 ADM FLR TIMs LTR
application/pdf 73.66 KB
11/8/2022
73.66 KB
Data Sheet
Name
Description
File Size
Date
Size
HT4500 - Thermally Conductive Gap Filler
application/pdf 38.81 KB
2/3/2022
38.81 KB
HT4500 - Thermally Conductive Gap Filler
application/pdf 38.81 KB
9/14/2022
38.81 KB
Name
Description
File Size
Date
Size
HT4500 - Thermally Conductive Gap Filler
38.81 KB
2/3/2022
38.81 KB
879055 ADM FLR TIMs LTR
73.66 KB
9/7/2022
73.66 KB
Thermal Interface Materials Electronics Brochure
819.47 KB
9/7/2022
819.47 KB
HT4500 - Thermally Conductive Gap Filler
38.81 KB
9/14/2022
38.81 KB
Thermal Interface Materials Electronics Brochure
819.47 KB
9/14/2022
819.47 KB
879055 ADM FLR TIMs LTR
73.66 KB
9/14/2022
73.66 KB
HT4500 - Thermally Conductive Gap Filler
42.4 KB
11/8/2022
42.4 KB
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
819.47 KB
879055 ADM FLR TIMs LTR
73.66 KB
11/8/2022
73.66 KB
Name
Description
File Size
Date
Size
HT4500 - Thermally Conductive Gap Filler
42.4 KB
11/8/2022
879055 ADM FLR TIMs LTR
73.66 KB
9/7/2022
Thermal Interface Materials Electronics Brochure
819.47 KB
9/7/2022
Thermal Interface Materials Electronics Brochure
819.47 KB
9/14/2022
879055 ADM FLR TIMs LTR
73.66 KB
9/14/2022
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
879055 ADM FLR TIMs LTR
73.66 KB
11/8/2022
HT4500 - Thermally Conductive Gap Filler
38.81 KB
2/3/2022
HT4500 - Thermally Conductive Gap Filler
38.81 KB
9/14/2022