Thermal Grease
TG3000
Honeywell silicone grease products provide superior thermal performance with ease of use across many applications. Provides low viscosity and inherent thixotropy for large-scale production with dispensing and screen and stencil printing. (3.0 W/m·K)
Overview
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High Thermal Conductivity Honeywell silicone grease products provide superior thermal performance with ease of use across a multitude of applications. The low viscosity and inherent thixotropy make the technology a good fit for large-scale production with dispensing, screen printing and stencil printing. Thermal Grease is a common silicone thermal interface material, usually used to increase thermal contact conductance across jointed solid surfaces. Thermal interface materials occupy the space of air (a very poor thermal conductor) and fill in the gaps between two solid surfaces. This establishes an effective thermal path between a heat-generating component and a heat sink attached to it, greatly increasing thermal transfer efficiency.Typical Applications• CPU, GPU and chipsets• LED assemblies• Automotive electronics• IGBT & power units• Flipchip BGAs• Range of thermal properties to fit different needsFeatures• Low viscosity and excellent thixotropy for dispensing or stencil/screen printing• Range of BLT thicknesses• Thermal resistance and thermal conductivity options for different power densities• High stability and reliability• Stable and homogeneous at room temperature storage• Range of thermal properties to fit different needs
Specifications
Others
- Color
- Grey
- Bond-Line Thickness (BLT)
- 25 µm at 35 psi, 50 °C, Test Method HON Internal
- Thermal Conductivity
- 3.0 W/m-K, Test Method Hot Disk
- Thermal Impedance
- 0.009 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
- Specific Gravity
- 2.7, Test Method ASTM D374
- Shelf Life
- 12 months Year
- Viscosity
- 150000 cps at 25 °C, Test Method Brookfield Viscometer
- Dielectric Constant
- >10 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 1.0x1012 ohm-cm, Test Method ASTM D257
- Flammability
- V-0, Test Method UL94
- Working Temperature
- -40-150 °C
- Storage Temperature
- Room Temperature
- Typical Uses
- Flipchip BGAs
- IGBT & power units
- LED assemblies
- Key Features
- Cost effectiveness
- Application
- Thin Bondline
Others
- Color
- Grey
- Bond-Line Thickness (BLT)
- 25 µm at 35 psi, 50 °C, Test Method HON Internal
- Thermal Conductivity
- 3.0 W/m-K, Test Method Hot Disk
- Thermal Impedance
- 0.009 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
- Specific Gravity
- 2.7, Test Method ASTM D374
- Shelf Life
- 12 months Year
- Viscosity
- 150000 cps at 25 °C, Test Method Brookfield Viscometer
- Dielectric Constant
- >10 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 1.0x1012 ohm-cm, Test Method ASTM D257
- Flammability
- V-0, Test Method UL94
- Working Temperature
- -40-150 °C
- Storage Temperature
- Room Temperature
- Typical Uses
- Flipchip BGAs
- IGBT & power units
- LED assemblies
- Key Features
- Cost effectiveness
- Application
- Thin Bondline
- Color : Grey
- Bond-Line Thickness (BLT) : 25 µm at 35 psi, 50 °C, Test Method HON Internal
- Thermal Conductivity : 3.0 W/m-K, Test Method Hot Disk
- Thermal Impedance : 0.009 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
- Specific Gravity : 2.7, Test Method ASTM D374
- Shelf Life : 12 months Year
- Viscosity : 150000 cps at 25 °C, Test Method Brookfield Viscometer
- Dielectric Constant : >10 at 1MHz, Test Method ASTM D150
- Volume Resistivity : 1.0x1012 ohm-cm, Test Method ASTM D257
- Flammability : V-0, Test Method UL94
- Working Temperature : -40-150 °C
- Storage Temperature : Room Temperature
- Typical Uses : Flipchip BGAs|IGBT & power units|LED assemblies
- Key Features : Cost effectiveness
- Application : Thin Bondline
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
11/8/2022
819.47 KB
Data Sheet
Name
Description
File Size
Date
Size
Thermal Grease: TG2000I - TG5500
application/pdf 242.77 KB
11/8/2022
242.77 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
819.47 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
