Thermal Grease
TG2000I
Honeywell silicone grease products provide superior thermal performance with ease of use across many applications. Provides low viscosity and inherent thixotropy for large-scale production with dispensing and screen and stencil printing. (2.0 W/m·K)
Overview
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High Thermal Conductivity Honeywell silicone grease products provide superior thermal performance with ease of use across a multitude of applications. The low viscosity and inherent thixotropy make the technology a good fit for large-scale production with dispensing, screen printing and stencil printing. Thermal Grease is a common silicone thermal interface material, usually used to increase thermal contact conductance across jointed solid surfaces. Thermal interface materials occupy the space of air (a very poor thermal conductor) and fill in the gaps between two solid surfaces. This establishes an effective thermal path between a heat-generating component and a heat sink attached to it, greatly increasing thermal transfer efficiency.Typical Applications• CPU, GPU and chipsets• LED assemblies• Automotive electronics• IGBT & power units• Flipchip BGAs• Range of thermal properties to fit different needsFeatures• Low viscosity and excellent thixotropy for dispensing or stencil/screen printing• Range of BLT thicknesses• Thermal resistance and thermal conductivity options for different power densities• High stability and reliability• Stable and homogeneous at room temperature storage• Range of thermal properties to fit different needs
Specifications
Physical Properties
- Specific Gravity
- 3.0, Test Method ASTM D792
- Bond-Line Thickness BLT
- 30 µm at 35 psi, 50 °C, Test Method HON Internal
- Color
- Blue
- Viscosity
- 90000 cps at 25 °C, Test Method Brookfield Viscometer
- Shelf Life
- 12 months Year
Thermal Properties
- Thermal Conductivity
- 2.0 W/m-K, Test Method Hot Disk
- Thermal Impedance
- 0.020 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
Flammability Properties
- Flammability
- V-0, Test Method UL94
- Working Temperature
- -40-150 °C
Electrical Properties
- Volume Resistivity
- 1.0x1013 ohm-cm, Test Method ASTM D257
- Dielectric Constant
- >6 at 1MHz, Test Method ASTM D150
Temperature
- Storage Temperature
- Room Temperature
General Information
- Key Features
- Electrical isolation
- Cost effectiveness
- Application
- Thin Bondline
- Thin Bondline
- Typical Uses
- LED assemblies
- IGBT & power units
- Flipchip BGAs
- CPU, GPU and chipsets
- Automotive electronics
Physical Properties
- Specific Gravity
- 3.0, Test Method ASTM D792
- Bond-Line Thickness BLT
- 30 µm at 35 psi, 50 °C, Test Method HON Internal
- Color
- Blue
- Viscosity
- 90000 cps at 25 °C, Test Method Brookfield Viscometer
- Shelf Life
- 12 months Year
Thermal Properties
- Thermal Conductivity
- 2.0 W/m-K, Test Method Hot Disk
- Thermal Impedance
- 0.020 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
Flammability Properties
- Flammability
- V-0, Test Method UL94
- Working Temperature
- -40-150 °C
Electrical Properties
- Volume Resistivity
- 1.0x1013 ohm-cm, Test Method ASTM D257
- Dielectric Constant
- >6 at 1MHz, Test Method ASTM D150
Temperature
- Storage Temperature
- Room Temperature
General Information
- Key Features
- Electrical isolation
- Cost effectiveness
- Application
- Thin Bondline
- Thin Bondline
- Typical Uses
- LED assemblies
- IGBT & power units
- Flipchip BGAs
- CPU, GPU and chipsets
- Automotive electronics
- Specific Gravity : 3.0, Test Method ASTM D792
- Bond-Line Thickness BLT : 30 µm at 35 psi, 50 °C, Test Method HON Internal
- Thermal Conductivity : 2.0 W/m-K, Test Method Hot Disk
- Color : Blue
- Thermal Impedance : 0.020 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
- Viscosity : 90000 cps at 25 °C, Test Method Brookfield Viscometer
- Shelf Life : 12 months Year
- Flammability : V-0, Test Method UL94
- Volume Resistivity : 1.0x1013 ohm-cm, Test Method ASTM D257
- Dielectric Constant : >6 at 1MHz, Test Method ASTM D150
- Working Temperature : -40-150 °C
- Storage Temperature : Room Temperature
- Key Features : Electrical isolation|Cost effectiveness
- Application : Thin Bondline|Thin Bondline
- Typical Uses : LED assemblies|IGBT & power units|Flipchip BGAs|CPU, GPU and chipsets|Automotive electronics
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
11/8/2022
819.47 KB
Data Sheet
Name
Description
File Size
Date
Size
Thermal Grease: TG2000I - TG5500
application/pdf 242.77 KB
11/8/2022
242.77 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
819.47 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022