Thermal Gap Filler Pads
TGP5000
Very good elastic modulus. Naturally tacky, requiring no additional adhesive which could inhibit thermal performance. Available thickness from 0.5 to 5 mm. (Blue color, 0.3 Thermal Impedance, 5.0 Thermal Conductivity, Hardness 45 on Shore 00)
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Honeywell Thermal Gap Filler Pads (TGPs) provide high thermal performance with ease of use for many applications. Ultra-high compressibility enables low stress and excellent conformity to mating surfaces. Honeywell TGP models are naturally tacky, and require no additional adhesive which could inhibit thermal performance. TGP models have been designed to minimize thermal resistance at interfaces, and maintain effective performance through reliability testing. TGP models are silicone based, therefore they offer a certain anti-shock effect, with electrical isolation and non-flammability.Typical Applications• Consumer electronics• Telecommunications & network servers• Automotive electronics• Power devices & modules• Semiconductor logic & memoryFeatures• High thermal performance• Ultra-high compressibility for low stress applications• Excellent surface wetting for low contact resistance• High reliability• Electrically insulating
Physical Properties
- Thickness mm
- 0.5-5, Test Method ASTM D374
- Hardness
- 45 Shore00, Test Method ASTM D2240
- Color
- Blue
- Specific Gravity
- 3.3, Test Method ASTM D792
- Shelf Life
- 12 months
Thermal Properties
- Thermal Conductivity
- 5.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.30 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- 5.0 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 8.0x1013 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Key Features
- Low Hardness
- Application
- High Compressibility
- Typical Uses
- Consumer electronics
- Telecommunications & network servers
- Power devices & modules
- Semiconductor logic & memory
- Automotive electronics
Physical Properties
- Thickness mm
- 0.5-5, Test Method ASTM D374
- Hardness
- 45 Shore00, Test Method ASTM D2240
- Color
- Blue
- Specific Gravity
- 3.3, Test Method ASTM D792
- Shelf Life
- 12 months
Thermal Properties
- Thermal Conductivity
- 5.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.30 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- 5.0 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 8.0x1013 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Key Features
- Low Hardness
- Application
- High Compressibility
- Typical Uses
- Consumer electronics
- Telecommunications & network servers
- Power devices & modules
- Semiconductor logic & memory
- Automotive electronics
- Thickness mm : 0.5-5, Test Method ASTM D374
- Hardness : 45 Shore00, Test Method ASTM D2240
- Thermal Conductivity : 5.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance : 0.30 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
- Color : Blue
- Specific Gravity : 3.3, Test Method ASTM D792
- Shelf Life : 12 months
- Dielectric Constant : 5.0 at 1MHz, Test Method ASTM D150
- Volume Resistivity : 8.0x1013 ohm-cm, Test Method ASTM D257
- Flammability : V-0, Test Method UL94
- Key Features : Low Hardness
- Application : High Compressibility
- Typical Uses : Consumer electronics|Telecommunications & network servers|Power devices & modules|Semiconductor logic & memory|Automotive electronics
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
9/7/2022
819.47 KB
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
9/14/2022
819.47 KB
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
11/8/2022
819.47 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
819.47 KB
9/7/2022
819.47 KB
Thermal Interface Materials Electronics Brochure
819.47 KB
9/14/2022
819.47 KB
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
819.47 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
819.47 KB
9/7/2022
Thermal Interface Materials Electronics Brochure
819.47 KB
9/14/2022
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022