/content/industrial/us/en/search-results.html
Outage Notification: This website will undergo a planned maintenance outage on Saturday, June 5, from 12:30-2:30 p.m. EDT (6:30-8:30 p.m. UDT). We regret any inconvenience this may cause.

Thermal Gap Filler Pads

TGP1200

Very low hardness, naturally tacky and ideal for nondemanding applications. (Blue color, 1.03 Thermal Impedance, 1.2 Thermal Conductivity, Thickness 0.5 - 5 mm, Hardness 30 Shore 00)

Request Free Samples
Honeywell Thermal Gap Filler Pads (TGPs) provide high thermal performance with ease of use for many applications. Ultra-high compressibility enables low stress and excellent conformity to mating surfaces. Honeywell TGP models are naturally tacky, and require no additional adhesive which could inhibit thermal performance. TGP models have been designed to minimize thermal resistance at interfaces, and maintain effective performance through reliability testing. TGP models are silicone based, therefore they offer a certain anti-shock effect, with electrical isolation and non-flammability.Typical Applications• Consumer electronics• Telecommunications & network servers• Automotive electronics• Power devices & modules• Semiconductor logic & memoryFeatures• High thermal performance• Ultra-high compressibility for low stress applications• Excellent surface wetting for low contact resistance• High reliability• Electrically insulating

Thermal Properties

  • Thermal Conductivity
    • 1.2 W/m-K, Test Method ASTM D5470
  • Thermal Impedance
    • 1.03 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470

Physical Properties

  • Hardness
    • 30 Shore00, Test Method ASTM D2240
  • Color
    • Blue
  • Specific Gravity
    • 1.7, Test Method ASTM D792
  • Thickness mm
    • 0.5-5, Test Method ASTM D374
  • Shelf Life
    • 12 months

Electrical Properties

  • Dielectric Constant
    • 4.5 at 1MHz, Test Method ASTM D150
  • Volume Resistivity
    • 4.0x1012 ohm-cm, Test Method ASTM D257

Flammability Properties

  • Flammability
    • V-0, Test Method UL94

General Information

  • Key Features
    • Cost effectiveness
    • Cost effectiveness
  • Application
    • High Compressibility
  • Typical Uses
    • Consumer electronics
    • Telecommunications & network servers
    • Power devices & modules
    • Semiconductor logic & memory
    • Automotive electronics

Thermal Properties

  • Thermal Conductivity
    • 1.2 W/m-K, Test Method ASTM D5470
  • Thermal Impedance
    • 1.03 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470

Physical Properties

  • Hardness
    • 30 Shore00, Test Method ASTM D2240
  • Color
    • Blue
  • Specific Gravity
    • 1.7, Test Method ASTM D792
  • Thickness mm
    • 0.5-5, Test Method ASTM D374
  • Shelf Life
    • 12 months

Electrical Properties

  • Dielectric Constant
    • 4.5 at 1MHz, Test Method ASTM D150
  • Volume Resistivity
    • 4.0x1012 ohm-cm, Test Method ASTM D257

Flammability Properties

  • Flammability
    • V-0, Test Method UL94

General Information

  • Key Features
    • Cost effectiveness
    • Cost effectiveness
  • Application
    • High Compressibility
  • Typical Uses
    • Consumer electronics
    • Telecommunications & network servers
    • Power devices & modules
    • Semiconductor logic & memory
    • Automotive electronics
  • Thermal Conductivity : 1.2 W/m-K, Test Method ASTM D5470
  • Hardness : 30 Shore00, Test Method ASTM D2240
  • Color : Blue
  • Specific Gravity : 1.7, Test Method ASTM D792
  • Thickness mm : 0.5-5, Test Method ASTM D374
  • Thermal Impedance : 1.03 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
  • Shelf Life : 12 months
  • Dielectric Constant : 4.5 at 1MHz, Test Method ASTM D150
  • Volume Resistivity : 4.0x1012 ohm-cm, Test Method ASTM D257
  • Flammability : V-0, Test Method UL94
  • Key Features : Cost effectiveness|Cost effectiveness
  • Application : High Compressibility
  • Typical Uses : Consumer electronics|Telecommunications & network servers|Power devices & modules|Semiconductor logic & memory|Automotive electronics
Brochure
Name
Description
File Size
Date
Size
Thermal Gap Filler Pads
application/pdf 52.38 KB
5/5/2022
52.38 KB
879055 ADM FLR TIMs LTR
application/pdf 73.66 KB
9/7/2022
73.66 KB
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
9/7/2022
819.47 KB
Thermal Gap Filler Pads
application/pdf 52.38 KB
9/14/2022
52.38 KB
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
9/14/2022
819.47 KB
879055 ADM FLR TIMs LTR
application/pdf 73.66 KB
9/14/2022
73.66 KB
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
11/8/2022
819.47 KB
879055 ADM FLR TIMs LTR
application/pdf 73.66 KB
11/8/2022
73.66 KB
Thermal Gap Filler Pads
application/pdf 52.38 KB
11/8/2022
52.38 KB
Name
Description
File Size
Date
Size
Thermal Gap Filler Pads
52.38 KB
5/5/2022
52.38 KB
879055 ADM FLR TIMs LTR
73.66 KB
9/7/2022
73.66 KB
Thermal Interface Materials Electronics Brochure
819.47 KB
9/7/2022
819.47 KB
Thermal Gap Filler Pads
52.38 KB
9/14/2022
52.38 KB
Thermal Interface Materials Electronics Brochure
819.47 KB
9/14/2022
819.47 KB
879055 ADM FLR TIMs LTR
73.66 KB
9/14/2022
73.66 KB
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
819.47 KB
879055 ADM FLR TIMs LTR
73.66 KB
11/8/2022
73.66 KB
Thermal Gap Filler Pads
52.38 KB
11/8/2022
52.38 KB
Name
Description
File Size
Date
Size
Thermal Gap Filler Pads
52.38 KB
5/5/2022
879055 ADM FLR TIMs LTR
73.66 KB
9/7/2022
Thermal Interface Materials Electronics Brochure
819.47 KB
9/7/2022
Thermal Gap Filler Pads
52.38 KB
9/14/2022
Thermal Interface Materials Electronics Brochure
819.47 KB
9/14/2022
879055 ADM FLR TIMs LTR
73.66 KB
9/14/2022
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
879055 ADM FLR TIMs LTR
73.66 KB
11/8/2022
Thermal Gap Filler Pads
52.38 KB
11/8/2022