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Thermal Gap Filler Pads

TGP1200

Very low hardness, naturally tacky and ideal for nondemanding applications. (Blue color, 1.03 Thermal Impedance, 1.2 Thermal Conductivity, Thickness 0.5 - 5 mm, Hardness 30 Shore 00)

Honeywell Thermal Gap Filler Pads (TGPs) provide high thermal performance with ease of use for many applications. Ultra-high compressibility enables low stress and excellent conformity to mating surfaces. Honeywell TGP models are naturally tacky, and require no additional adhesive which could inhibit thermal performance. TGP models have been designed to minimize thermal resistance at interfaces, and maintain effective performance through reliability testing. TGP models are silicone based, therefore they offer a certain anti-shock effect, with electrical isolation and non-flammability.Typical Applications• Consumer electronics• Telecommunications & network servers• Automotive electronics• Power devices & modules• Semiconductor logic & memoryFeatures• High thermal performance• Ultra-high compressibility for low stress applications• Excellent surface wetting for low contact resistance• High reliability• Electrically insulating

Physical Properties

  • Color
    • Blue
  • Hardness
    • 30 Shore00, Test Method ASTM D2240
  • Thermal Conductivity
    • 1.2 W/m-K, Test Method ASTM D5470
  • Thermal Impedance
    • 1.03 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
  • Thickness (mm)
    • 0.5-5, Test Method ASTM D374
  • Specific Gravity
    • 1.7, Test Method ASTM D792

Electrical Properties

  • Volume Resistivity
    • 4.0x1012 ohm-cm, Test Method ASTM D257
  • Dielectric Constant
    • 4.5 at 1MHz, Test Method ASTM D150

Safety & Environment

  • Flammability
    • V-0, Test Method UL94

Physical Properties

  • Color
    • Blue
  • Hardness
    • 30 Shore00, Test Method ASTM D2240
  • Thermal Conductivity
    • 1.2 W/m-K, Test Method ASTM D5470
  • Thermal Impedance
    • 1.03 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
  • Thickness (mm)
    • 0.5-5, Test Method ASTM D374
  • Specific Gravity
    • 1.7, Test Method ASTM D792

Electrical Properties

  • Volume Resistivity
    • 4.0x1012 ohm-cm, Test Method ASTM D257
  • Dielectric Constant
    • 4.5 at 1MHz, Test Method ASTM D150

Safety & Environment

  • Flammability
    • V-0, Test Method UL94
  • Color : Blue
  • Hardness : 30 Shore00, Test Method ASTM D2240
  • Thermal Conductivity : 1.2 W/m-K, Test Method ASTM D5470
  • Thermal Impedance : 1.03 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
  • Thickness (mm) : 0.5-5, Test Method ASTM D374
  • Specific Gravity : 1.7, Test Method ASTM D792
  • Volume Resistivity : 4.0x1012 ohm-cm, Test Method ASTM D257
  • Dielectric Constant : 4.5 at 1MHz, Test Method ASTM D150
  • Flammability : V-0, Test Method UL94
Brochure
Name
Description
File Size
Date
Size
Thermal Gap Filler Pads
52.38 KB
9/3/2021
PDF 52.38 KB
Thermal Interface Materials Electronics Brochure
4.13 MB
9/3/2021
PDF 4.13 MB
Name
Description
File Size
Date
Size
Thermal Gap Filler Pads
52.38 KB
9/3/2021
PDF 52.38 KB
Thermal Interface Materials Electronics Brochure
4.13 MB
9/3/2021
PDF 4.13 MB