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Silicon Etchants

Nitric Acid Etching Mixture (17383)

SWF 200-600-200, VLSI Puranal

Overview
Request Free Samples
Specifications

General Information

  • Grade
    • VLSI

Physical Properties

  • pH
    • < 1
  • Partition Coefficient
    • No data available
  • Flashpoint
    • Not applicable
  • Melting Point/Range
    • No data available
  • Boiling Point/Range
    • No data available
  • Density
    • 1.12 g/cm3 (20 °C)
  • Physical Form
    • Liquid
  • Odor
    • Stinging
  • Color
    • Colorless to Yellowish
  • Vapor Pressure
    • No data available hectopascal

Safety Information

  • Ignition Temperature
    • Not applicable
  • Corrosivity
    • Corrosive to metals
  • Flammability
    • Not applicable
  • Oxidizing
    • The substance or mixture is not classified as oxidizing.
  • Incompatible Materials
    • Evolution of toxic gases/vapours, Hydrogen by reaction with metals, Glass and silicate-containing materials are attacked
  • Thermal Decomposition
    • To avoid thermal decomposition, do not overheat.
  • Self Ignition
    • Not auto-flammable

International Transportation

  • Harmonized System Code
    • 38249996
  • Chemical Class
    • 8
  • Packing Group
    • II
  • Sub Class 1
    • 6.1
  • UN Number
    • 2922

General Information

  • Grade
    • VLSI

Physical Properties

  • pH
    • < 1
  • Partition Coefficient
    • No data available
  • Flashpoint
    • Not applicable
  • Melting Point/Range
    • No data available
  • Boiling Point/Range
    • No data available
  • Density
    • 1.12 g/cm3 (20 °C)
  • Physical Form
    • Liquid
  • Odor
    • Stinging
  • Color
    • Colorless to Yellowish
  • Vapor Pressure
    • No data available hectopascal

Safety Information

  • Ignition Temperature
    • Not applicable
  • Corrosivity
    • Corrosive to metals
  • Flammability
    • Not applicable
  • Oxidizing
    • The substance or mixture is not classified as oxidizing.
  • Incompatible Materials
    • Evolution of toxic gases/vapours, Hydrogen by reaction with metals, Glass and silicate-containing materials are attacked
  • Thermal Decomposition
    • To avoid thermal decomposition, do not overheat.
  • Self Ignition
    • Not auto-flammable

International Transportation

  • Harmonized System Code
    • 38249996
  • Chemical Class
    • 8
  • Packing Group
    • II
  • Sub Class 1
    • 6.1
  • UN Number
    • 2922
  • Grade : VLSI
  • pH : < 1
  • Partition Coefficient : No data available
  • Flashpoint : Not applicable
  • Melting Point/Range : No data available
  • Boiling Point/Range : No data available
  • Density : 1.12 g/cm3 (20 °C)
  • Physical Form : Liquid
  • Odor : Stinging
  • Color : Colorless to Yellowish
  • Vapor Pressure : No data available hectopascal
  • Ignition Temperature : Not applicable
  • Corrosivity : Corrosive to metals
  • Flammability : Not applicable
  • Oxidizing : The substance or mixture is not classified as oxidizing.
  • Incompatible Materials : Evolution of toxic gases/vapours, Hydrogen by reaction with metals, Glass and silicate-containing materials are attacked
  • Thermal Decomposition : To avoid thermal decomposition, do not overheat.
  • Self Ignition : Not auto-flammable
  • Harmonized System Code : 38249996
  • Chemical Class : 8
  • Packing Group : II
  • Sub Class 1 : 6.1
  • UN Number : 2922
Sales Sheet
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.61 KB
9/7/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
9/7/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
9/7/2022
Property
Value
particles > 0,5 µm
Max. 250 P/ml
assay of HNO3
17.0 - 18.0 %
assay of HF
9.5 - 11.0 %
silver (Ag)
Max. 0.02 ppm
aluminium (Al)
Max. 0.05 ppm
arsenic (As)
Max. 0.01 ppm
gold (Au)
Max. 0.02 ppm
barium (Ba)
Max. 0.10 ppm
beryllium (Be)
Max. 0.02 ppm
bismuth (Bi)
Max. 0.02 ppm
calcium (Ca)
Max. 0.10 ppm
cadmium (Cd)
Max. 0.01 ppm
cobalt (Co)
Max. 0.01 ppm
chromium (Cr)
Max. 0.05 ppm
copper (Cu)
Max. 0.01 ppm
iron (Fe)
Max. 0.10 ppm
gallium (Ga)
Max. 0.02 ppm
indium (In)
Max. 0.02 ppm
potassium (K)
Max. 0.10 ppm
lithium (Li)
Max. 0.02 ppm
magnesium (Mg)
Max. 0.10 ppm
manganese (Mn)
Max. 0.01 ppm
molybdenum (Mo)
Max. 0.05 ppm
sodium (Na)
Max. 0.30 ppm
nickel (Ni)
Max. 0.02 ppm
lead (Pb)
Max. 0.02 ppm
platinum (Pt)
Max. 0.02 ppm
tin (Sn)
Max. 0.02 ppm
strontium (Sr)
Max. 0.02 ppm
titanium (Ti)
Max. 0.01 ppm
thallium (Tl)
Max. 0.02 ppm
vanadium (V)
Max. 0.01 ppm
zinc (Zn)
Max. 0.05 ppm
zirconium (Zr)
Max. 0.01 ppm
chloride (Cl)
Max. 0.2 ppm
phosphate (PO4)
Max. 0.10 ppm
sulfate (SO4)
Max. 0.50 ppm
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