Silicon Etchants
Nitric Acid Etchant Mixture (17278)
SF 907-93 VLSI Puranal
Overview
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Specifications
General Information
- Grade
- SemEG
Physical Properties
- pH
- Acidic
- Vapor Pressure
- No data available hectopascal
- Color
- Colorless
- Boiling Point/Range
- 120 °C
- Density
- 1.40 g/cm3 (20 °C)
- Physical Form
- Liquid
- Partition Coefficient
- No data available
- Odor
- Stinging
- Melting Point/Range
- No data available
- Flashpoint
- Not applicable
Safety Information
- Self Ignition
- Not auto-flammable
- Flammability
- Not applicable
- Corrosivity
- Corrosive to metals
- Ignition Temperature
- Not applicable
- Thermal Decomposition
- To avoid thermal decomposition, do not overheat.
- Incompatible Materials
- Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
International Transportation
- Harmonized System Code
- 38249996
- Chemical Class
- 8
- Packing Group
- II
- Sub Class 1
- 6.1
- UN Number
- 2922
General Information
- Grade
- SemEG
Physical Properties
- pH
- Acidic
- Vapor Pressure
- No data available hectopascal
- Color
- Colorless
- Boiling Point/Range
- 120 °C
- Density
- 1.40 g/cm3 (20 °C)
- Physical Form
- Liquid
- Partition Coefficient
- No data available
- Odor
- Stinging
- Melting Point/Range
- No data available
- Flashpoint
- Not applicable
Safety Information
- Self Ignition
- Not auto-flammable
- Flammability
- Not applicable
- Corrosivity
- Corrosive to metals
- Ignition Temperature
- Not applicable
- Thermal Decomposition
- To avoid thermal decomposition, do not overheat.
- Incompatible Materials
- Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
International Transportation
- Harmonized System Code
- 38249996
- Chemical Class
- 8
- Packing Group
- II
- Sub Class 1
- 6.1
- UN Number
- 2922
- Grade : SemEG
- pH : Acidic
- Vapor Pressure : No data available hectopascal
- Color : Colorless
- Boiling Point/Range : 120 °C
- Density : 1.40 g/cm3 (20 °C)
- Physical Form : Liquid
- Partition Coefficient : No data available
- Odor : Stinging
- Melting Point/Range : No data available
- Flashpoint : Not applicable
- Self Ignition : Not auto-flammable
- Flammability : Not applicable
- Corrosivity : Corrosive to metals
- Ignition Temperature : Not applicable
- Thermal Decomposition : To avoid thermal decomposition, do not overheat.
- Incompatible Materials : Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
- Harmonized System Code : 38249996
- Chemical Class : 8
- Packing Group : II
- Sub Class 1 : 6.1
- UN Number : 2922
Sales Sheet
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.61 KB
9/7/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
9/7/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
9/7/2022
Property
Value
particles > 0,5 µm
Max. 250 P/ml
assay of HNO3
63.5 - 64.5 %
assay hydrofluoric acid (HF)
3.65 - 3.85 %
silver (Ag)
Max. 0.01 ppm
aluminium (Al)
Max. 0.05 ppm
gold (Au)
Max. 0.02 ppm
barium (Ba)
Max. 0.01 ppm
beryllium (Be)
Max. 0.01 ppm
bismuth (Bi)
Max. 0.02 ppm
calcium (Ca)
Max. 0.10 ppm
cadmium (Cd)
Max. 0.01 ppm
cobalt (Co)
Max. 0.01 ppm
chromium (Cr)
Max. 0.01 ppm
copper (Cu)
Max. 0.01 ppm
iron (Fe)
Max. 0.05 ppm
gallium (Ga)
Max. 0.01 ppm
germanium (Ge)
Max. 0.05 ppm
indium (In)
Max. 0.01 ppm
potassium (K)
Max. 0.05 ppm
lithium (Li)
Max. 0.01 ppm
magnesium (Mg)
Max. 0.02 ppm
manganese (Mn)
Max. 0.01 ppm
molybdenum (Mo)
Max. 0.01 ppm
sodium (Na)
Max. 0.10 ppm
nickel (Ni)
Max. 0.01 ppm
lead (Pb)
Max. 0.01 ppm
platinum (Pt)
Max. 0.02 ppm
tin (Sn)
Max. 0.02 ppm
strontium (Sr)
Max. 0.01 ppm
titanium (Ti)
Max. 0.01 ppm
thallium (Tl)
Max. 0.02 ppm
vanadium (V)
Max. 0.01 ppm
zinc (Zn)
Max. 0.05 ppm
zirconium (Zr)
Max. 0.01 ppm
chloride (Cl)
Max. 0.1 ppm
phosphate (PO4)
Max. 0.2 ppm
sulfate (SO4)
Max. 0.5 ppm