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Silicon Etchants

Defreckle Etch 2 (17565)

Puranal

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Physical Properties

  • Flashpoint
    • Not applicable
  • Physical Form
    • Liquid
  • pH
    • Acidic
  • Melting Point/Range
    • No data available
  • Odor
    • Vinegar-Like
  • Boiling Point/Range
    • > 100 °C (1,013 hPa)
  • Color
    • Colorless

Safety Information

  • Thermal Decomposition
    • Fire or intense heat may cause violent rupture of packages.
  • Ignition Temperature
    • Not applicable
  • Incompatible Materials
    • Corrosive in contact with metals, Glass and silicate-containing materials are attacked, Reactions with organic substances
  • Corrosivity
    • Corrosive to metals

International Transportation

  • Chemical Class
    • 8
  • Sub Class 1
    • 6.1
  • Harmonized System Code
    • 38249996
  • Packing Group
    • II
  • UN Number
    • 2922

Physical Properties

  • Flashpoint
    • Not applicable
  • Physical Form
    • Liquid
  • pH
    • Acidic
  • Melting Point/Range
    • No data available
  • Odor
    • Vinegar-Like
  • Boiling Point/Range
    • > 100 °C (1,013 hPa)
  • Color
    • Colorless

Safety Information

  • Thermal Decomposition
    • Fire or intense heat may cause violent rupture of packages.
  • Ignition Temperature
    • Not applicable
  • Incompatible Materials
    • Corrosive in contact with metals, Glass and silicate-containing materials are attacked, Reactions with organic substances
  • Corrosivity
    • Corrosive to metals

International Transportation

  • Chemical Class
    • 8
  • Sub Class 1
    • 6.1
  • Harmonized System Code
    • 38249996
  • Packing Group
    • II
  • UN Number
    • 2922
  • Flashpoint : Not applicable
  • Physical Form : Liquid
  • pH : Acidic
  • Melting Point/Range : No data available
  • Odor : Vinegar-Like
  • Boiling Point/Range : > 100 °C (1,013 hPa)
  • Color : Colorless
  • Thermal Decomposition : Fire or intense heat may cause violent rupture of packages.
  • Ignition Temperature : Not applicable
  • Incompatible Materials : Corrosive in contact with metals, Glass and silicate-containing materials are attacked, Reactions with organic substances
  • Corrosivity : Corrosive to metals
  • Chemical Class : 8
  • Sub Class 1 : 6.1
  • Harmonized System Code : 38249996
  • Packing Group : II
  • UN Number : 2922
Sales Sheet
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.61 KB
5/5/2022
961.61 KB
Texture Etch-wafer thinning materials
application/pdf 961.61 KB
9/14/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
5/5/2022
961.61 KB
Texture Etch-wafer thinning materials
961.61 KB
9/14/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
5/5/2022
Texture Etch-wafer thinning materials
961.61 KB
9/14/2022
Property
Value
assay of phosphoric acid (H3PO4)
71.0 - 74.0 %
assay of HNO3
2.0 - 3.0 %
assay of HF
0.45 - 0.55 %
assay of acetic acid
9.5 - 11.5 %
aluminium (Al)
Max. 0.3 ppm
arsenic (As)
Max. 0.05 ppm
gold (Au)
Max. 0.15 ppm
calcium (Ca)
Max. 1 ppm
cadmium (Cd)
Max. 0.45 ppm
cobalt (Co)
Max. 0.05 ppm
chromium (Cr)
Max. 0.2 ppm
copper (Cu)
Max. 0.05 ppm
iron (Fe)
Max. 1 ppm
potassium (K)
Max. 0.45 ppm
lithium (Li)
Max. 0.1 ppm
magnesium (Mg)
Max. 0.2 ppm
manganese (Mn)
Max. 0.1 ppm
sodium (Na)
Max. 0.5 ppm
nickel (Ni)
Max. 0.2 ppm
lead (Pb)
Max. 0.3 ppm
antimony (Sb)
Max. 3.5 ppm
strontium (Sr)
Max. 0.1 ppm
titanium (Ti)
Max. 0.3 ppm
zinc (Zn)
Max. 0.4 ppm
chloride (Cl)
Max. 1 ppm
sulfate (SO4)
Max. 30 ppm