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Thermal One-Part Hybrids

HT7000

Honeywell HT series products are precured one component, made of cross-linked silicone w/ceramic particles, dispensable and reworkable, high compressibility for low stress applications, no mixing, and additional curing or low temp storage (7.0 W/m·K)

One-Part Dispensable Very Low Compression Force Thermal conductivity liquid gap fillers not only have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability — they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces. Hybrid is a substance between liquid and solid, combining the advantages of thermal grease and thermal gap pad.Typical Applications• Consumer electronics• Telecommunications equipment• Automotive electronics• Power supplies & semiconductors• Memory & power modules• Power electronicsFeatures• High thermal performance and low contact resistance• Easily dispensable and reworkable• High compressibility for low stress applications• Long-term reliability• No pump-out or cracking risk• Reduced oil separation• Requires no mixing, additional curing or low temperature storage

Physical Properties

  • Outgassing
    • N/A
  • Color
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  • Dispense Rate
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  • Shelf Life
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  • Thermal Conductivity
    • 7.0 W/m-K, Test Method ASTM D5470
  • Thermal Impedance
    • N/A
  • Specific Gravity
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Temperature

  • Storage Temperature
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Physical Properties

  • Outgassing
    • N/A
  • Color
    • N/A
  • Dispense Rate
    • N/A
  • Shelf Life
    • N/A
  • Thermal Conductivity
    • 7.0 W/m-K, Test Method ASTM D5470
  • Thermal Impedance
    • N/A
  • Specific Gravity
    • N/A

Temperature

  • Storage Temperature
    • N/A
  • Outgassing : N/A
  • Color : N/A
  • Dispense Rate : N/A
  • Shelf Life : N/A
  • Thermal Conductivity : 7.0 W/m-K, Test Method ASTM D5470
  • Thermal Impedance : N/A
  • Specific Gravity : N/A
  • Storage Temperature : N/A