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Thermal One-Part Hybrids

HT3500

Honeywell HT series products are precured one component, made of cross-linked silicone w/ceramic particles, dispensable and reworkable, high compressibility for low stress applications, no mixing, and additional curing or low temp storage (3.5 W/m·K)

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One-Part Dispensable Very Low Compression Force Thermal conductivity liquid gap fillers not only have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability — they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces. Hybrid is a substance between liquid and solid, combining the advantages of thermal grease and thermal gap pad.Typical Applications• Consumer electronics• Telecommunications equipment• Automotive electronics• Power supplies & semiconductors• Memory & power modules• Power electronicsFeatures• High thermal performance and low contact resistance• Easily dispensable and reworkable• High compressibility for low stress applications • Long-term reliability• No pump-out or cracking risk• Reduced oil separation• Requires no mixing, additional curing or low temperature storage

Physical Properties

  • Specific Gravity
    • 3.2, Test Method ASTM D792
  • Outgassing
    • <0.5%, Test Method ASTM E595 (TML)
  • Dispense Rate
    • >10 g/min, Test Method 90psi, 30cc EFD syringe
  • Color
    • Dark Red
  • Shelf Life
    • 6 months

Thermal Properties

  • Thermal Conductivity
    • 3.5 W/m-K, Test Method ASTM D5470
  • Thermal Impedance
    • <0.35 °C·cm²/W, Test Method ASTM D5470 at BLT

Temperature

  • Storage Temperature
    • RT

General Information

  • Key Features
    • Cost Effectiveness
    • High thermal performance and low contact resistance
    • Easily dispensable and reworkable
    • High compressibility for low stress applications
    • Long-term reliability
    • No pump-out or cracking risk
    • Reduced oil separation
  • Application
    • Automation Gap Filler
  • Typical Uses
    • Consumer electronics
    • Telecommunications equipment
    • Automotive electronics
    • Power supplies
    • Memory & power modules
    • Power electronics

Physical Properties

  • Specific Gravity
    • 3.2, Test Method ASTM D792
  • Outgassing
    • <0.5%, Test Method ASTM E595 (TML)
  • Dispense Rate
    • >10 g/min, Test Method 90psi, 30cc EFD syringe
  • Color
    • Dark Red
  • Shelf Life
    • 6 months

Thermal Properties

  • Thermal Conductivity
    • 3.5 W/m-K, Test Method ASTM D5470
  • Thermal Impedance
    • <0.35 °C·cm²/W, Test Method ASTM D5470 at BLT

Temperature

  • Storage Temperature
    • RT

General Information

  • Key Features
    • Cost Effectiveness
    • High thermal performance and low contact resistance
    • Easily dispensable and reworkable
    • High compressibility for low stress applications
    • Long-term reliability
    • No pump-out or cracking risk
    • Reduced oil separation
  • Application
    • Automation Gap Filler
  • Typical Uses
    • Consumer electronics
    • Telecommunications equipment
    • Automotive electronics
    • Power supplies
    • Memory & power modules
    • Power electronics
  • Specific Gravity : 3.2, Test Method ASTM D792
  • Outgassing : <0.5%, Test Method ASTM E595 (TML)
  • Thermal Conductivity : 3.5 W/m-K, Test Method ASTM D5470
  • Dispense Rate : >10 g/min, Test Method 90psi, 30cc EFD syringe
  • Thermal Impedance : <0.35 °C·cm²/W, Test Method ASTM D5470 at BLT
  • Color : Dark Red
  • Shelf Life : 6 months
  • Storage Temperature : RT
  • Key Features : Cost Effectiveness|High thermal performance and low contact resistance|Easily dispensable and reworkable|High compressibility for low stress applications|Long-term reliability|No pump-out or cracking risk|Reduced oil separation
  • Application : Automation Gap Filler
  • Typical Uses : Consumer electronics|Telecommunications equipment|Automotive electronics|Power supplies|Memory & power modules|Power electronics
Others
Name
Description
File Size
Date
Size
Thermal One-Part Hybrid: HT3500 - HT5000
application/pdf 69.98 KB
6/18/2021
69.98 KB
Brochure
Name
Description
File Size
Date
Size
879055 ADM FLR TIMs LTR
application/pdf 73.66 KB
9/7/2022
73.66 KB
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
9/7/2022
819.47 KB
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
9/14/2022
819.47 KB
879055 ADM FLR TIMs LTR
application/pdf 73.66 KB
9/14/2022
73.66 KB
Name
Description
File Size
Date
Size
Thermal One-Part Hybrid: HT3500 - HT5000
69.98 KB
6/18/2021
69.98 KB
879055 ADM FLR TIMs LTR
73.66 KB
9/7/2022
73.66 KB
Thermal Interface Materials Electronics Brochure
819.47 KB
9/7/2022
819.47 KB
Thermal Interface Materials Electronics Brochure
819.47 KB
9/14/2022
819.47 KB
879055 ADM FLR TIMs LTR
73.66 KB
9/14/2022
73.66 KB
Name
Description
File Size
Date
Size
Thermal One-Part Hybrid: HT3500 - HT5000
69.98 KB
6/18/2021
879055 ADM FLR TIMs LTR
73.66 KB
9/7/2022
Thermal Interface Materials Electronics Brochure
819.47 KB
9/7/2022
Thermal Interface Materials Electronics Brochure
819.47 KB
9/14/2022
879055 ADM FLR TIMs LTR
73.66 KB
9/14/2022