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Silicon Etchants

Nitric Acid Etching Mixture (17764)

SPF 64(65)-19-17(40) MOS Puranal

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General Information

  • Grade
    • SemEG

Physical Properties

  • pH
    • Acidic
  • Flashpoint
    • Not applicable
  • Odor
    • Stinging
  • Solubility in Water
    • Completely miscible
  • Color
    • Colorless
  • Melting Point/Range
    • No data available
  • Density
    • 1.410 g/cm3 20 °C
  • Physical Form
    • Liquid
  • Boiling Point/Range
    • > 100 °C 1,013 hPa

Safety Information

  • Corrosivity
    • Corrosive to metals
  • Thermal Decomposition
    • No decomposition if used as directed.
  • Incompatible Materials
    • Corrosive in contact with metals, Glass and silicate-containing materials are attacked
  • Ignition Temperature
    • Not applicable

International Transportation

  • Sub Class 1
    • 6.1
  • Chemical Class
    • 8
  • Packing Group
    • II
  • UN Number
    • 2922
  • Harmonized System Code
    • 38249996

General Information

  • Grade
    • SemEG

Physical Properties

  • pH
    • Acidic
  • Flashpoint
    • Not applicable
  • Odor
    • Stinging
  • Solubility in Water
    • Completely miscible
  • Color
    • Colorless
  • Melting Point/Range
    • No data available
  • Density
    • 1.410 g/cm3 20 °C
  • Physical Form
    • Liquid
  • Boiling Point/Range
    • > 100 °C 1,013 hPa

Safety Information

  • Corrosivity
    • Corrosive to metals
  • Thermal Decomposition
    • No decomposition if used as directed.
  • Incompatible Materials
    • Corrosive in contact with metals, Glass and silicate-containing materials are attacked
  • Ignition Temperature
    • Not applicable

International Transportation

  • Sub Class 1
    • 6.1
  • Chemical Class
    • 8
  • Packing Group
    • II
  • UN Number
    • 2922
  • Harmonized System Code
    • 38249996
  • Grade : SemEG
  • pH : Acidic
  • Flashpoint : Not applicable
  • Odor : Stinging
  • Solubility in Water : Completely miscible
  • Color : Colorless
  • Melting Point/Range : No data available
  • Density : 1.410 g/cm3 20 °C
  • Physical Form : Liquid
  • Boiling Point/Range : > 100 °C 1,013 hPa
  • Corrosivity : Corrosive to metals
  • Thermal Decomposition : No decomposition if used as directed.
  • Incompatible Materials : Corrosive in contact with metals, Glass and silicate-containing materials are attacked
  • Ignition Temperature : Not applicable
  • Sub Class 1 : 6.1
  • Chemical Class : 8
  • Packing Group : II
  • UN Number : 2922
  • Harmonized System Code : 38249996
Sales Sheet
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.61 KB
5/5/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
5/5/2022
961.61 KB
Property
Value
nitric acid
40.0 - 42.0 %
assay hydrofluoric acid (HF)
5.0 - 6.0 %
assay of phosphoric acid (H3PO4)
18.5 - 20.5 %
arsenic (As)
Max. 0.5 ppm
calcium (Ca)
Max. 20 ppm
cadmium (Cd)
Max. 5.0 ppm
cobalt (Co)
Max. 5.0 ppm
copper (Cu)
Max. 5.0 ppm
iron (Fe)
Max. 10 ppm
potassium (K)
Max. 10 ppm
magnesium (Mg)
Max. 10 ppm
manganese (Mn)
Max. 5.0 ppm
sodium (Na)
Max. 20 ppm
nickel (Ni)
Max. 5.0 ppm
lead (Pb)
Max. 5.0 ppm
zinc (Zn)
Max. 10 ppm
chloride (Cl)
Max. 5.0 ppm
sulfate (SO4)
Max. 30 ppm