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Silicon Etchants

Nitric Acid Etching Mixture (17693)

SWF 600-388-12 VLSI Puranal

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Physical Properties

  • Odor
    • Weak
  • Color
    • Colorless
  • Flashpoint
    • Not applicable
  • Melting Point/Range
    • No data available
  • Boiling Point/Range
    • > 100 °C (1,013 hPa)
  • Physical Form
    • Liquid
  • pH
    • < 1.0 (20 °C)

Safety Information

  • Corrosivity
    • Corrosive to metals
  • Ignition Temperature
    • Not applicable
  • Incompatible Materials
    • Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
  • Thermal Decomposition
    • To avoid thermal decomposition, do not overheat.

International Transportation

  • Harmonized System Code
    • 38249996
  • Sub Class 1
    • 6.1
  • Packing Group
    • II
  • UN Number
    • 2922
  • Chemical Class
    • 8

Physical Properties

  • Odor
    • Weak
  • Color
    • Colorless
  • Flashpoint
    • Not applicable
  • Melting Point/Range
    • No data available
  • Boiling Point/Range
    • > 100 °C (1,013 hPa)
  • Physical Form
    • Liquid
  • pH
    • < 1.0 (20 °C)

Safety Information

  • Corrosivity
    • Corrosive to metals
  • Ignition Temperature
    • Not applicable
  • Incompatible Materials
    • Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
  • Thermal Decomposition
    • To avoid thermal decomposition, do not overheat.

International Transportation

  • Harmonized System Code
    • 38249996
  • Sub Class 1
    • 6.1
  • Packing Group
    • II
  • UN Number
    • 2922
  • Chemical Class
    • 8
  • Odor : Weak
  • Color : Colorless
  • Flashpoint : Not applicable
  • Melting Point/Range : No data available
  • Boiling Point/Range : > 100 °C (1,013 hPa)
  • Physical Form : Liquid
  • pH : < 1.0 (20 °C)
  • Corrosivity : Corrosive to metals
  • Ignition Temperature : Not applicable
  • Incompatible Materials : Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
  • Thermal Decomposition : To avoid thermal decomposition, do not overheat.
  • Harmonized System Code : 38249996
  • Sub Class 1 : 6.1
  • Packing Group : II
  • UN Number : 2922
  • Chemical Class : 8
Sales Sheet
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.61 KB
5/5/2022
961.61 KB
Texture Etch-wafer thinning materials
application/pdf 961.61 KB
9/14/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
5/5/2022
961.61 KB
Texture Etch-wafer thinning materials
961.61 KB
9/14/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
5/5/2022
Texture Etch-wafer thinning materials
961.61 KB
9/14/2022
Property
Value
particles > 0,5 µm
Max. 250 P/ml
assay of HNO3
46.5 - 48.5 %
assay hydrofluoric acid (HF)
0.5 - 0.6 %
residue on ignition (as SO4)
Max. 5 ppm
silver (Ag)
Max. 0.01 ppm
aluminium (Al)
Max. 0.05 ppm
arsenic, antimony (as As)
Max. 0.01 ppm
gold (Au)
Max. 0.02 ppm
barium (Ba)
Max. 0.01 ppm
beryllium (Be)
Max. 0.01 ppm
bismuth (Bi)
Max. 0.02 ppm
calcium (Ca)
Max. 0.10 ppm
cadmium (Cd)
Max. 0.01 ppm
cobalt (Co)
Max. 0.01 ppm
chromium (Cr)
Max. 0.01 ppm
copper (Cu)
Max. 0.01 ppm
iron (Fe)
Max. 0.05 ppm
gallium (Ga)
Max. 0.01 ppm
germanium (Ge)
Max. 0.05 ppm
indium (In)
Max. 0.01 ppm
potassium (K)
Max. 0.05 ppm
lithium (Li)
Max. 0.01 ppm
magnesium (Mg)
Max. 0.02 ppm
manganese (Mn)
Max. 0.01 ppm
molybdenum (Mo)
Max. 0.01 ppm
sodium (Na)
Max. 0.10 ppm
nickel (Ni)
Max. 0.01 ppm
lead (Pb)
Max. 0.01 ppm
platinum (Pt)
Max. 0.02 ppm
tin (Sn)
Max. 0.02 ppm
strontium (Sr)
Max. 0.01 ppm
titanium (Ti)
Max. 0.01 ppm
thallium (Tl)
Max. 0.02 ppm
vanadium (V)
Max. 0.01 ppm
zinc (Zn)
Max. 0.05 ppm
zirconium (Zr)
Max. 0.01 ppm
chloride (Cl)
Max. 0.10 ppm
phosphate (PO4)
Max. 0.20 ppm
sulfate (SO4)
Max. 0.50 ppm