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Silicon Etchants

Nitric Acid Etching Mixture (17579)

SEF 750-125-125 Puranal

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General Information

  • Grade
    • SemEG

Physical Properties

  • Density
    • 1.33 g/cm3 20 °C
  • Color
    • Colorless
  • Solubility in Water
    • Completely miscible
  • Odor
    • Stinging
  • pH
    • Acidic
  • Flashpoint
    • Not applicable
  • Melting Point/Range
    • No data available
  • Physical Form
    • Liquid
  • Boiling Point/Range
    • > 100 °C 1,013 hPa

Safety Information

  • Ignition Temperature
    • Not applicable
  • Corrosivity
    • Corrosive to metals
  • Thermal Decomposition
    • To avoid thermal decomposition, do not overheat.
  • Incompatible Materials
    • Glass and silicate-containing materials are attacked, Reactions with combustible substances, Hydrogen by reaction with metals

International Transportation

  • Chemical Class
    • 8
  • UN Number
    • 2922
  • Packing Group
    • II
  • Harmonized System Code
    • 38249996
  • Sub Class 1
    • 6.1

General Information

  • Grade
    • SemEG

Physical Properties

  • Density
    • 1.33 g/cm3 20 °C
  • Color
    • Colorless
  • Solubility in Water
    • Completely miscible
  • Odor
    • Stinging
  • pH
    • Acidic
  • Flashpoint
    • Not applicable
  • Melting Point/Range
    • No data available
  • Physical Form
    • Liquid
  • Boiling Point/Range
    • > 100 °C 1,013 hPa

Safety Information

  • Ignition Temperature
    • Not applicable
  • Corrosivity
    • Corrosive to metals
  • Thermal Decomposition
    • To avoid thermal decomposition, do not overheat.
  • Incompatible Materials
    • Glass and silicate-containing materials are attacked, Reactions with combustible substances, Hydrogen by reaction with metals

International Transportation

  • Chemical Class
    • 8
  • UN Number
    • 2922
  • Packing Group
    • II
  • Harmonized System Code
    • 38249996
  • Sub Class 1
    • 6.1
  • Grade : SemEG
  • Density : 1.33 g/cm3 20 °C
  • Color : Colorless
  • Solubility in Water : Completely miscible
  • Odor : Stinging
  • pH : Acidic
  • Flashpoint : Not applicable
  • Melting Point/Range : No data available
  • Physical Form : Liquid
  • Boiling Point/Range : > 100 °C 1,013 hPa
  • Ignition Temperature : Not applicable
  • Corrosivity : Corrosive to metals
  • Thermal Decomposition : To avoid thermal decomposition, do not overheat.
  • Incompatible Materials : Glass and silicate-containing materials are attacked, Reactions with combustible substances, Hydrogen by reaction with metals
  • Chemical Class : 8
  • UN Number : 2922
  • Packing Group : II
  • Harmonized System Code : 38249996
  • Sub Class 1 : 6.1
Sales Sheet
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.61 KB
5/5/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
5/5/2022
961.61 KB
Property
Value
nitric acid
54.6 - 56.6 %
acetic acid (CH3COOH)
8.8 - 10.8 %
assay hydrofluoric acid (HF)
4.9 - 5.9 %
residue on ignition
Max. 20 ppm
arsenic (As)
Max. 0.1 ppm
copper (Cu)
Max. 0.1 ppm
iron (Fe)
Max. 1 ppm
potassium (K)
Max. 0.1 ppm
sodium (Na)
Max. 0.5 ppm
zinc (Zn)
Max. 0.1 ppm
chloride (Cl)
Max. 5 ppm
phosphate (PO4)
Max. 2 ppm
sulfate (SO4)
Max. 5 ppm