Silicon Etchants
Nitric Acid Etching Mixture (17579)
SEF 750-125-125 Puranal
Overview
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Specifications
General Information
- Grade
- SemEG
Physical Properties
- Density
- 1.33 g/cm3 (20 °C)
- Color
- Colorless
- Odor
- Stinging
- pH
- Acidic
- Flashpoint
- Not applicable
- Melting Point/Range
- No data available
- Physical Form
- Liquid
- Boiling Point/Range
- > 100 °C (1,013 hPa)
Safety Information
- Ignition Temperature
- Not applicable
- Corrosivity
- Corrosive to metals
- Thermal Decomposition
- To avoid thermal decomposition, do not overheat.
- Incompatible Materials
- Glass and silicate-containing materials are attacked, Reactions with combustible substances, Hydrogen by reaction with metals
International Transportation
- Chemical Class
- 8
- UN Number
- 2922
- Packing Group
- II
- Harmonized System Code
- 38249996
- Sub Class 1
- 6.1
General Information
- Grade
- SemEG
Physical Properties
- Density
- 1.33 g/cm3 (20 °C)
- Color
- Colorless
- Odor
- Stinging
- pH
- Acidic
- Flashpoint
- Not applicable
- Melting Point/Range
- No data available
- Physical Form
- Liquid
- Boiling Point/Range
- > 100 °C (1,013 hPa)
Safety Information
- Ignition Temperature
- Not applicable
- Corrosivity
- Corrosive to metals
- Thermal Decomposition
- To avoid thermal decomposition, do not overheat.
- Incompatible Materials
- Glass and silicate-containing materials are attacked, Reactions with combustible substances, Hydrogen by reaction with metals
International Transportation
- Chemical Class
- 8
- UN Number
- 2922
- Packing Group
- II
- Harmonized System Code
- 38249996
- Sub Class 1
- 6.1
- Grade : SemEG
- Density : 1.33 g/cm3 (20 °C)
- Color : Colorless
- Odor : Stinging
- pH : Acidic
- Flashpoint : Not applicable
- Melting Point/Range : No data available
- Physical Form : Liquid
- Boiling Point/Range : > 100 °C (1,013 hPa)
- Ignition Temperature : Not applicable
- Corrosivity : Corrosive to metals
- Thermal Decomposition : To avoid thermal decomposition, do not overheat.
- Incompatible Materials : Glass and silicate-containing materials are attacked, Reactions with combustible substances, Hydrogen by reaction with metals
- Chemical Class : 8
- UN Number : 2922
- Packing Group : II
- Harmonized System Code : 38249996
- Sub Class 1 : 6.1
Sales Sheet
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.61 KB
9/7/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
9/7/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
9/7/2022
Property
Value
nitric acid
54.6 - 56.6 %
acetic acid (CH3COOH)
8.8 - 10.8 %
assay hydrofluoric acid (HF)
4.9 - 5.9 %
residue on ignition
Max. 20 ppm
arsenic (As)
Max. 0.1 ppm
copper (Cu)
Max. 0.1 ppm
iron (Fe)
Max. 1 ppm
potassium (K)
Max. 0.1 ppm
sodium (Na)
Max. 0.5 ppm
zinc (Zn)
Max. 0.1 ppm
chloride (Cl)
Max. 5 ppm
phosphate (PO4)
Max. 2 ppm
sulfate (SO4)
Max. 5 ppm