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Buffered Oxide Etchants

Oxide Etch 7:1 Modified (17662)

VLSI Puranal 250

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General Information

  • Grade
    • VLSI

Physical Properties

  • Odor
    • Stinging
  • pH
    • Acidic
  • Physical Form
    • Liquid
  • Color
    • Colorless
  • Solubility in Water
    • Completely miscible
  • Density
    • 1.070 g/cm3 20 °C
  • Flashpoint
    • Not applicable
  • Boiling Point/Range
    • > 100 °C 1,013 hPa

Safety Information

  • Chemical Stability
    • Stable under normal conditions.
  • Thermal Decomposition
    • No decomposition if used as directed.
  • Incompatible Materials
    • Corrosive in contact with metals, Contact with strong acids liberates hydrogen fluoride, Glass and silicate-containing materials are attacked
  • Corrosivity
    • Corrosive to metals
  • Ignition Temperature
    • Not applicable

International Transportation

  • Packing Group
    • II
  • UN Number
    • 3264
  • Harmonized System Code
    • 38249996
  • Chemical Class
    • 8

General Information

  • Grade
    • VLSI

Physical Properties

  • Odor
    • Stinging
  • pH
    • Acidic
  • Physical Form
    • Liquid
  • Color
    • Colorless
  • Solubility in Water
    • Completely miscible
  • Density
    • 1.070 g/cm3 20 °C
  • Flashpoint
    • Not applicable
  • Boiling Point/Range
    • > 100 °C 1,013 hPa

Safety Information

  • Chemical Stability
    • Stable under normal conditions.
  • Thermal Decomposition
    • No decomposition if used as directed.
  • Incompatible Materials
    • Corrosive in contact with metals, Contact with strong acids liberates hydrogen fluoride, Glass and silicate-containing materials are attacked
  • Corrosivity
    • Corrosive to metals
  • Ignition Temperature
    • Not applicable

International Transportation

  • Packing Group
    • II
  • UN Number
    • 3264
  • Harmonized System Code
    • 38249996
  • Chemical Class
    • 8
  • Grade : VLSI
  • Odor : Stinging
  • pH : Acidic
  • Physical Form : Liquid
  • Color : Colorless
  • Solubility in Water : Completely miscible
  • Density : 1.070 g/cm3 20 °C
  • Flashpoint : Not applicable
  • Boiling Point/Range : > 100 °C 1,013 hPa
  • Chemical Stability : Stable under normal conditions.
  • Thermal Decomposition : No decomposition if used as directed.
  • Incompatible Materials : Corrosive in contact with metals, Contact with strong acids liberates hydrogen fluoride, Glass and silicate-containing materials are attacked
  • Corrosivity : Corrosive to metals
  • Ignition Temperature : Not applicable
  • Packing Group : II
  • UN Number : 3264
  • Harmonized System Code : 38249996
  • Chemical Class : 8
Property
Value
particles > 0,5 µm
Max. 250 P/ml
ammonium fluoride (NH4F)
14.5 - 15.5 %
assay hydrofluoric acid (HF)
5.0 - 5.4 %
etch rate (nm/min)
70 - 80 nm/min
surface tension
Max. 40 mN/m
residue on ignition (SO4)
Max. 10 ppm
silver (Ag)
Max. 0.01 ppm
aluminium (Al)
Max. 0.05 ppm
arsenic, antimony (as As)
Max. 0.03 ppm
gold (Au)
Max. 0.02 ppm
boron (B)
Max. 0.05 ppm
barium (Ba)
Max. 0.01 ppm
beryllium (Be)
Max. 0.01 ppm
bismuth (Bi)
Max. 0.02 ppm
calcium (Ca)
Max. 0.1 ppm
cadmium (Cd)
Max. 0.01 ppm
cobalt (Co)
Max. 0.01 ppm
chromium (Cr)
Max. 0.01 ppm
copper (Cu)
Max. 0.01 ppm
iron (Fe)
Max. 0.05 ppm
gallium (Ga)
Max. 0.01 ppm
germanium (Ge)
Max. 0.05 ppm
indium (In)
Max. 0.01 ppm
potassium (K)
Max. 0.05 ppm
lithium (Li)
Max. 0.01 ppm
magnesium (Mg)
Max. 0.05 ppm
manganese (Mn)
Max. 0.01 ppm
molybdenum (Mo)
Max. 0.01 ppm
sodium (Na)
Max. 0.1 ppm
nickel (Ni)
Max. 0.01 ppm
lead (Pb)
Max. 0.01 ppm
platinum (Pt)
Max. 0.05 ppm
silicon (Si)
Max. 200 ppm
tin (Sn)
Max. 0.02 ppm
strontium (Sr)
Max. 0.01 ppm
titanium (Ti)
Max. 0.01 ppm
thallium (Tl)
Max. 0.02 ppm
vanadium (V)
Max. 0.01 ppm
zinc (Zn)
Max. 0.05 ppm
zirconium (Zr)
Max. 0.01 ppm
chloride (Cl)
Max. 4 ppm
phosphate (PO4)
Max. 0.2 ppm
sulfate (SO4)
Max. 2 ppm