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Buffered Oxide Etchants

Ammonium Fluoride Etching Mixture (17682)

AF 90-10 LST VLSI Puranal P

Overview
Request Free Samples
Specifications

General Information

  • CAS Number
    • 12125-01-8
  • Grade
    • VLSI

Physical Properties

  • Density
    • 1.115 g/cm3 (20 °C)
  • Odor
    • Stinging
  • Melting Point/Range
    • No data available
  • Flashpoint
    • Not applicable
  • pH
    • Acidic
  • Physical Form
    • Liquid
  • Boiling Point/Range
    • > 100 °C (1,013 hPa)
  • Color
    • Colorless

Safety Information

  • Thermal Decomposition
    • No decomposition if used as directed.
  • Incompatible Materials
    • Glass and silicate-containing materials are attacked, Contact with strong acids liberates hydrogen fluoride, Corrosive in contact with metal
  • Chemical Stability
    • Stable under normal conditions.
  • Corrosivity
    • Corrosive to metals
  • Ignition Temperature
    • Not applicable

International Transportation

  • Harmonized System Code
    • 38249996
  • Packing Group
    • II
  • UN Number
    • 3264
  • Chemical Class
    • 8

General Information

  • CAS Number
    • 12125-01-8
  • Grade
    • VLSI

Physical Properties

  • Density
    • 1.115 g/cm3 (20 °C)
  • Odor
    • Stinging
  • Melting Point/Range
    • No data available
  • Flashpoint
    • Not applicable
  • pH
    • Acidic
  • Physical Form
    • Liquid
  • Boiling Point/Range
    • > 100 °C (1,013 hPa)
  • Color
    • Colorless

Safety Information

  • Thermal Decomposition
    • No decomposition if used as directed.
  • Incompatible Materials
    • Glass and silicate-containing materials are attacked, Contact with strong acids liberates hydrogen fluoride, Corrosive in contact with metal
  • Chemical Stability
    • Stable under normal conditions.
  • Corrosivity
    • Corrosive to metals
  • Ignition Temperature
    • Not applicable

International Transportation

  • Harmonized System Code
    • 38249996
  • Packing Group
    • II
  • UN Number
    • 3264
  • Chemical Class
    • 8
  • CAS Number : 12125-01-8
  • Grade : VLSI
  • Density : 1.115 g/cm3 (20 °C)
  • Odor : Stinging
  • Melting Point/Range : No data available
  • Flashpoint : Not applicable
  • pH : Acidic
  • Physical Form : Liquid
  • Boiling Point/Range : > 100 °C (1,013 hPa)
  • Color : Colorless
  • Thermal Decomposition : No decomposition if used as directed.
  • Incompatible Materials : Glass and silicate-containing materials are attacked, Contact with strong acids liberates hydrogen fluoride, Corrosive in contact with metal
  • Chemical Stability : Stable under normal conditions.
  • Corrosivity : Corrosive to metals
  • Ignition Temperature : Not applicable
  • Harmonized System Code : 38249996
  • Packing Group : II
  • UN Number : 3264
  • Chemical Class : 8
Property
Value
particles > 0,5 µm
Max. 250 P/ml
surface tension
28 - 32 mN/m
ammonium fluoride (NH4F)
35.3 - 36.3 %
assay hydrofluoric acid (HF)
5.1 - 5.5 %
residue on ignition (SO4)
Max. 10 ppm
silver (Ag)
Max. 0.01 ppm
aluminium (Al)
Max. 0.05 ppm
arsenic, antimony (as As)
Max. 0.03 ppm
gold (Au)
Max. 0.02 ppm
boron (B)
Max. 0.05 ppm
barium (Ba)
Max. 0.01 ppm
beryllium (Be)
Max. 0.01 ppm
bismuth (Bi)
Max. 0.02 ppm
calcium (Ca)
Max. 0.1 ppm
cadmium (Cd)
Max. 0.01 ppm
cobalt (Co)
Max. 0.01 ppm
chromium (Cr)
Max. 0.01 ppm
copper (Cu)
Max. 0.01 ppm
iron (Fe)
Max. 0.05 ppm
gallium (Ga)
Max. 0.01 ppm
germanium (Ge)
Max. 0.05 ppm
indium (In)
Max. 0.01 ppm
potassium (K)
Max. 0.05 ppm
lithium (Li)
Max. 0.01 ppm
magnesium (Mg)
Max. 0.05 ppm
manganese (Mn)
Max. 0.01 ppm
molybdenum (Mo)
Max. 0.01 ppm
sodium (Na)
Max. 0.1 ppm
nickel (Ni)
Max. 0.01 ppm
lead (Pb)
Max. 0.01 ppm
platinum (Pt)
Max. 0.05 ppm
silicon (Si)
Max. 50 ppm
tin (Sn)
Max. 0.02 ppm
strontium (Sr)
Max. 0.01 ppm
titanium (Ti)
Max. 0.01 ppm
thallium (Tl)
Max. 0.02 ppm
vanadium (V)
Max. 0.01 ppm
zinc (Zn)
Max. 0.05 ppm
zirconium (Zr)
Max. 0.01 ppm
chloride (Cl)
Max. 4 ppm
phosphate (PO4)
Max. 0.2 ppm
sulfate (SO4)
Max. 2 ppm
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