Cleaning chemistries are critical for reducing defect densities and improving yields. Our innovations in cleaning mixtures have created new blends that reduce cost of ownership, are more environmentally friendly and focus on new interconnect/dielectric materials. Whether repairing the wafer surface for a thermal process, deposition of a substrate or removal of residues from the preceding operation, HEC offers the reliability that your manufacturing process requires. Proprietary blends are available.
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