High Purity Evaporation Materials
Gold (Au)
Overview
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Sales Sheet
Name
Description
File Size
Date
Size
Metals for dieback metallization and underbump metallurgy (UBM) for flip chip applications
application/pdf 525.61 KB
9/7/2022
525.61 KB
Name
Description
File Size
Date
Size
Metals for dieback metallization and underbump metallurgy (UBM) for flip chip applications
525.61 KB
9/7/2022
525.61 KB
Name
Description
File Size
Date
Size
Metals for dieback metallization and underbump metallurgy (UBM) for flip chip applications
525.61 KB
9/7/2022
