Continued growth in flip chip packaging points toward the increased adoption of electroplating for wafer bumping applications. Honeywell is uniquely positioned to provide Sn- and Cu-based Plating Anodes for use in wafer bumping.
Honeywell RadLo Plating Anodes offer the following features:
- Available in various low alpha grades
- High purity (>99.99% pure)
- Precision machined
- Class 1000 cleanroom packaging
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